Master of Architecture funding for International Students at Bond University, Australia

About the scholarship

• Any Country
• Postgraduate
• Full-fee
• Architecture and Built Environment

The inaugural Master of Architecture Scholarships aim to provide high academic achievers with full-fee tuition remission for the Master of Architecture program at Bond University. These scholarships have been made available through the support of key partners including: 

• Condev Construction  
• HomeCorp 

As well as providing tuition remission, the Master of Architecture Scholarships will also provide experience and/or mentoring opportunities with sponsoring partners. 

Availability

Scholarships are available to eligible students wishing to commence the Master of Architecture program in either the September semester in 2020 or January semester in 2021. 

Eligibility

To be considered, applicants must: 

• Be currently achieving, or have achieved, a minimum cumulative percentage average of 75% from a Bond University Bachelor of Architectural Studies or an undergraduate degree program approved by the Australia New Zealand Architecture Program Accreditation Procedure (ANZAPAP). 
• Submit a personal statement and high-quality digital portfolio of relevant work produced during Bachelor degree candidature in support of their scholarship application; 
• Be accepted for admission and offered a place in the Master of Architecture degree. 

How to apply

Applications for this scholarship open on Friday, 1 May and close on Sunday 19 July. 

Upon completion of the Bond University Online Study Application form, eligible students can apply for this scholarship via the Scholarship Application Form. 

Students must complete and submit their scholarship application prior to the application closing date. 

As part of the scholarship application, students will be asked to submit the following: 

• A 300-500 word personal statement that explains interest in pursuing the Master of Architecture program as well as the relevance of the construction industry as part of career aspirations (e.g. background, future interests, affiliation with sponsoring partners etc);
• A digital portfolio submission. As part of the online scholarship application form, you will be asked to include a link to your portfolio via your file sharing (e.g. We Transfer or Dropbox). Online portfolios will be judged on the following criteria: Excellence in design capability, graphic communication ability, creative/technical skills and/or high-quality professional experience in relevant field; and Graphic clarity and coherence of the portfolio as a visual document; 

All submissions are treated in the strictest confidence and are provided to the Master of Architecture scholarship selection committee for consideration. Incomplete or late submissions will not be considered. 

Additional requirements

The successful scholarship recipient must: 

• Comply with Bond’s general scholarship terms and conditions. 
• Maintain a minimum average of 65% or better in the Master of Architecture program. 
• Be enrolled in the Master of Architecture program in the September semester in 2020 or January semester in 2021. No deferrals to a later semester will be considered. 
• Submit a reflection and academic transcript at the end of each semester to the sponsor. 
• Participate in promotional activities arranged by the sponsor and/or the University. 

Scholarships are non-transferrable and cannot be redeemed for cash. 
Acceptance of the scholarship implies agreement to meet these obligations. 

Official website